As Seen At
From LEAP
| Line 1: | Line 1: | ||
[[image:Startupscreen.JPG |400px|right|PAL]] | [[image:Startupscreen.JPG |400px|right|PAL]] | ||
| - | + | <br><br><br><br><br><br> | |
| + | <br><br><br><br><br><br> | ||
<br><br><br><br><br><br> | <br><br><br><br><br><br> | ||
[[image:ASMS_2010.png |300px|left|PAL]] | [[image:ASMS_2010.png |300px|left|PAL]] | ||
Revision as of 01:09, 27 May 2010
As Seen at the ASMS June 2010
LEAP Technologies presented "A fully automated system for Hydrogen Deuterium Exchange" at the 58th ASMS Conference on Mass Spectrometry and Allied Topics (ASMS) in Salt Lake City, Utah.
To see information about this system please follow our quick link HD/X Applications
LEAP Technologies also presented "DLW (Dynamic Load and Wash) for Fast and Clean LC/MS Loading" The DLW,Dynamic Load and Wash, is designed for today’s most sensitive MS instruments this completely new injection and wash concept gives Near Zero Carryover and can drastically reduced cycle times. The linked combination of the two steps which are usually separate - minimizes cycle time and carry over. The DLW,Dynamic Load and Wash, is designed to be used on the PAL line of robots at the 58th ASMS Conference on Mass Spectrometry and Allied Topics (ASMS) in Salt Lake City, Utah.
To see information about this system please follow our quick link DLW
LEAP Technologies also presented the "Collect PAL"Fraction Collector which features “0” sample loss during collection,“0” well-to-well carry over,“0” drips and spills between fraction sites, “0” loss due to evaporation at the 58th ASMS Conference on Mass Spectrometry and Allied Topics (ASMS) Salt Lake City, Utah.
To see information about this system please follow our quick link Collect PAL
As Seen at the Mid Atlantic LRIG May 2010
LEAP Technologies presented "A fully automated system for reconstituting semi-solid samples" at the Laboratory Robotics Interest Group Mid Atlantic Sixteenth Annual Technology Exhibition & Presentations (LRIG) in New Brunswick, NJ.
To see information about this system please follow our quick link Semi-Solid Applications
